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TECHSPEC® components are designed, specified, or manufactured by Edmund Optics. TECHSPEC® components are designed, specified, or manufactured by Edmund Optics. Learn More

19.1mm Dia., 6.35mm Thick, Fused Silica Uncoated Laser Window Substrate

TECHSPEC® Uncoated Laser Window Substrates

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Stock #38-911 In Stock
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C$185.50
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C$185.50
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C$167.30
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Clear Aperture CA (mm):
17.19
Coating:
Uncoated
Diameter (mm):
19.10 +0.00/-0.10
Substrate: Many glass manufacturers offer the same material characteristics under different trade names. Learn More
Fused Silica (Corning 7980)
Index of Refraction nd:
1.458
Surface Quality:
10-5
Thickness (mm):
6.35 ±0.20
Type:
Laser Window Substrate
Parallelism (arcmin):
<3
Bevel:
Protective as needed
Clear Aperture (%):
90
Abbe Number (vd):
67.8
Wavelength Range (nm):
200 - 2200
Surface Flatness (P-V):
λ/10
Fused Silica Grade:
7980 0F
Edges:
Fine Ground
Type of Window:
Glass

Regulatory Compliance

RoHS 2015:
Reach 219:
Certificate of Conformance:

Product Family Description

  • Up to 10-5 Surface Quality and λ/10 Surface Flatness Available
  • Fused Silica or N-BK7 Material
  • Standard Imperial Sizes for Drop-in Replacement Solutions
  • Laser Line Coated Versions Available
  • Mirror Substrates Also Available

TECHSPEC® Uncoated Laser Window Substrates are laser quality window substrates designed to be used in demanding laser applications. These laser window substrates are available, manufactured from fused silica for high power laser applications that require excellent thermal stability or from N-BK7 for more cost sensitive laser applications. Both the fused silica and N-BK7 laser window substrates feature precision grade λ/10 surface flatness and 10-5 surface quality, ensuring minimal disturbance to transmitted beams. TECHSPEC® Uncoated Laser Window Substrates are available in standard imperial sizes from 12.7 to 50.8mm in diameter for the convenience of drop-in replacement into existing laser systems. Custom dimensional and coating options are available, please contact us for custom inquiries.